Keynote Presentations

A number of high level keynote presentations is embedded in the technical program of ESTC 2016.


Heterogeneous integrated systems and technologies for IoT
Thomas Ernst, Scientific Director for Devices and Technologies Division - CEA LETI
scheduled on Tuesday September 13, 2016 – 13.45

IoT : Role, opportunity and challenges for IC packaging design and manufacturing
Laurent HERARD, Group VP, Head of the Corporate Packaging and Automation team - ST Microelectronics
scheduled on Tuesday September 13, 2016 – 14.30

SiP takes the Stage: Unveiling the power of heterogeneous integration
Rich RICE, Senior Vice President of Business Development for ASE Group
scheduled on Wednesday September 14, 2016 – 10.10

Passive integration challenges for the IoT
Franck Murray, Chief Executive Officer of IPDIA
scheduled on Wednesday September 14, 2016 – 17.10

2.5D and 3D-Based Interconnect and Integration Technologies for Electronics and Bioelectronic Microsystems
Muhannad BAKIR – Georgia Tech
scheduled on Thursday September 15, 2016 – 15.30